新復興微波通訊 | 高頻基板 | 電路板

高頻微波通訊基板 | 高效能散熱基板 | FR-4基板 | 特殊複合材料基板 | 特殊車用基板

Technology

Coin Insertion



Heat dissipating solution for high performance and high thermal conductivity application


Gold – ENIG surface finished



Gold – ENIG surface finished provides a longer shelf life than any other types of surface finished for PCBs. We optimize our process and offer Gold – ENIG immersion with 0.3 – 3 micron.

高頻微波通訊基板 | 高效能散熱基板 | FR-4基板 | 特殊複合材料基板 | 特殊車用基板

新復興微波通訊 | 高頻基板 | 電路板