新復興微波通訊 | 高頻基板 | 電路板

高頻微波通訊基板 | 高效能散熱基板 | FR-4基板 | 特殊複合材料基板 | 特殊車用基板

Thermally conductive PCB solution

Offer heat dissipating solutions which include heavy copper, metal core bonding and copper coin insertion solution for the high performance and high thermal conductivity applications.

 
GL1-1

 
GL2-1

 
GL3-1

Feature



  • Heavy Copper
  • High Thermal Conductivity
  • Metal Core Bonding

Applications



  • Work Station Power Supply
  • Base Station Transceiver
  • Server Accessories
  • Remote Radio Head
  • Small Cell

高頻微波通訊基板 | 高效能散熱基板 | FR-4基板 | 特殊複合材料基板 | 特殊車用基板

新復興微波通訊 | 高頻基板 | 電路板